UV研磨膠帶
UV研磨膠帶（UV Grinding Tape）：適用於錫球高度在50 micron以下厚度的產品，特性為低翹曲，高TTV（Total Thickness Variation）平坦度。
| Back Grinding Tape BL100-402 | ||
| Optimized UV BG tape for 8” and 12” wafer | ||
| No residues after UV irradiation | ||
| Easy peeling off after UV irradiation | ||
| Low Warpage／T.T.V. | ||
| Specification | Thickness（um） | 140 |
| UV adhesive layer（um） | 40±3 | |
| Substrate, PO（um） | 100 | |
| Color | transparent | |
| Adhesion（g／25mm） | Before UV: 400 | |
| After UV: < 10 | ||
| 8/12-inch dummy wafer test results | Final thickness 150um | T.T.V. : 3um |
